منابع مشابه
Thermoelectrics for Cooling Power Electronics
To increase the efficiency and reduce emissions, the hybrid electric vehicle (HEV), fuel cell vehicle (FCV), and electric vehicle (EV) types were developed. All these vehicle types rely on power electronics (PEs) to function. Yet, the reliability and performance of PEs are directly related to the operating temperature. Therefore, cooling is considered an option to reduce the operating temperatu...
متن کاملInkjet Assisted Spray Cooling of Electronics
Increases in microprocessor power dissipation and the resulting effect on the cost and complexity of thermal management solutions has been well documented in recent years. Accompanying this increase in overall power dissipation has been a reduction in feature size due to process improvements resulting in a steady decrease in the size of the processing core where most of the power on a die is ge...
متن کاملHigh Heat Flux Micro - Electronics Cooling
The temperature of an electronics device rises fairly linearly with increasing device heat flux. This relationship is especially problematic for defense electronics, where heat dissipation is projected to exceed 1000W/cm in the near future. This paper study explored the benefit of cooling the electronics device using indirect refrigeration cooling system .In this system the heat sink in a prima...
متن کاملMicrofluidic cooling for detectors and electronics
Micro-channel cooling is gaining considerable attention as an alternative technique for cooling of high energy physics detectors and front-end electronics. This technology is being evaluated for future tracking devices, where material budget limitations are a major concern. It is currently under investigation as an option for the cooling of the NA62 Gigatracker silicon pixel detector, where a m...
متن کاملCorona driven air propulsion for cooling of electronics
The possibility of building a high voltage electrostatic air pump for cooling of microelectronics is investigated. Existing cooling technology no longer provides adequate heat dissipation due to excessive heat generation caused by the growing component density on electronic devices. Heat sink fins are packed more closely to increase the heat exchange surface area, resulting in narrower channels...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Journal of Japan Institute of Electronics Packaging
سال: 2012
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.15.383